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A Nonintrusive Nonlinear Model Reduction Method for Thermal Cycling-Induced Viscoplastic Deformation Problems Based on Segmented Gaussian Process Regression Machine Learning

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A Nonintrusive Nonlinear Model Reduction Method for Thermal Cycling-Induced Viscoplastic Deformation Problems Based on Segmented Gaussian Process Regression Machine Learning

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Additional information

Journal

IEEE Access

Authors

JIUNN-HORNG LEE
CHIA-HSIU OU
CHIH-MIN YAO
MING-HSIAO LEE

Keywords

Flip chip package, Gaussian process regression, machine learning, proper orthogonal
decomposition, reduced order model, viscoplastic

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